Development of Cu/Insulation Layer Interface Crack Extension Simulation with Crystal Plasticity-Reference-Cited by-同舟云学术

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Development of Cu/Insulation Layer Interface Crack Extension Simulation with Crystal Plasticity

Published:2013-04-01 Issue:4S Volume:52 Page:04CB05
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Koiwa Kozo,Omiya Masaki,Shishido Nobuyuki,Kamiya Shoji,Sato Hisashi,Nishida Masahiro,Suzuki Takashi,Nakamura Tomoji,Suzuki Toshiaki,Nokuo Takeshi

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Reference30 articles.

1. Elastoplastic analysis of the peel test

2. Adhesion of titanium thin film to oxide substrates

3. Evaluation of Interfacial Strength by Multi-Stages Peel Test

4. Continuous microscratch measurements of the practical and true works of adhesion for metal/ceramic systems

5. Adhesion studies of magnetron-sputtered copper films on nickel substrates: Effects of substrate surface pretreatments

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Evaluation of Interfacial Fracture Strength in Micro-Scale Components Combined with High-Voltage Environmental Electron Microscopy;Experimental Mechanics;2015-03-17

2. Evaluation for interface strength fluctuations induced by inhomogeneous grain structure of Cu line in LSI Interconnects;Microelectronic Engineering;2014-05

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