Author:
Takahashi Y.,Arai S.,Yamamoto Y.,Higuchi K.,Kondo H.,Kitagawa Y.,Muto S.,Tanaka N.
Publisher
Springer Science and Business Media LLC
Subject
Mechanical Engineering,Mechanics of Materials,Aerospace Engineering
Reference40 articles.
1. Freund LB, Suresh S (2003) Thin film materials. Cambridge University Press, Cambridge
2. Alam MO, Wu BY, Chan YC, Rufer L (2006) Reliability of BGA solder joints on the Au/Ni/Cu bond pad – effect of thicknesses of Au and Ni layer. IEEE Trans Device Mater Reliab 6:421–428
3. Zhu X, Wang R, Peng C, Wei X, Peng J (2014) Reactions and mechanical properties between AuSn20 solders and metalized Al–Si alloys for electronic packaging application. J Mater Sci Mater Electron 25:742–748
4. Cao J, Feng JC, Li ZR (2008) Microstructure and fracture properties of reaction-assisted diffusion bonding of TiAl intermetallic with Al/Ni multilayer foils. J Alloys Compd 466:363–367
5. Bogy DB (1968) Edge bonded dissimilar orthogonal elastic wedges under normal and shear stress. J Appl Mech 35:146–154
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