Transient liquid-phase sintering using silver and tin powder mixture for die bonding-Reference-Cited by-同舟云学术

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Transient liquid-phase sintering using silver and tin powder mixture for die bonding

Published:2016-03-24 Issue:4S Volume:55 Page:04EC14
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Fujino Masahisa,Narusawa Hirozumi,Kuramochi Yuzuru,Higurashi Eiji,Suga Tadatomo,Shiratori Toshiyuki,Mizukoshi Masataka

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

http://stacks.iop.org/1347-4065/55/i=4S/a=04EC14/pdf

Reference30 articles.

1. Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection

2. A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint

3. Microstructural development in transient liquid-phase bonding

4. Transient Liquid Phase Bonding

5. Modelling of transient liquid phase bonding

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1. Enhanced thermal stability of joints formed by Ag-Cu supersaturated solid-solution nanoparticles paste by in-situ Cu nanoprecipitates;Journal of Materials Science & Technology;2025-04

2. Effects of Cu/SnAgCu Powder Fraction and Sintering Time on Microstructure and Mechanical Properties of Transient Liquid Phase Sintered Joints;Materials;2024-04-25

3. High-Temperature Reliability of Nano-Ag Sintered Joints on Ag-Plated Cu Substrates;Journal of Physics: Conference Series;2024-01-01

4. Growth kinetics and mechanical properties of the Cu20Sn6 phase transited from the full Cu3Sn joint during high temperature aging process;Journal of Materials Science: Materials in Electronics;2023-06

5. High-temperature effects on kinetics and grain orientation of the Cu41Sn11 phase formed from the full Cu3Sn joint during the aging process;Materials Chemistry and Physics;2022-10

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