Anodic Bonding of Transparent Conductive Oxide Coated Silicon Wafer to Glass Substrate for Solar Cell Applications
Author:
Publisher
IOP Publishing
Subject
General Physics and Astronomy,General Engineering
Link
http://stacks.iop.org/1882-0786/6/i=1/a=012302/pdf
Reference10 articles.
1. Field Assisted Glass‐Metal Sealing
2. Electrical characteristics of single-silicon TFT structure with symmetric dual-gate for kink-effect suppression
3. High performance pMOS circuits with silicon-on-glass TFTs
4. Single-crystal silicon films on glass
5. The Analysis of Oxygen Plasma Pretreatment for Improving Anodic Bonding
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1. III-V/Si wafer bonding using transparent, conductive oxide interlayers;Applied Physics Letters;2015-06-29
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