High heat flux dissipation via interposer active micro-cooling-Reference-Cited by-同舟云学术

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High heat flux dissipation via interposer active micro-cooling

Published:2019-03-04 Issue:SB Volume:58 Page:SBBB11
ISSN:0021-4922
Container-title:Japanese Journal of Applied Physics
language:
Short-container-title:Jpn. J. Appl. Phys.

Author:

Buja Federico,Zhang Lei,Cherman Vladimir,Oprins Herman,Ben Jones ,Soussan Philippe

Publisher

IOP Publishing

Subject

General Physics and Astronomy,Physics and Astronomy (miscellaneous),General Engineering

Link

http://stacks.iop.org/1347-4065/58/i=SB/a=SBBB11/pdf

Reference27 articles.

1. TRANSPORT IN MICROCHANNELS - A CRITICAL REVIEW

2. On-Chip Thermal Management With Microchannel Heat Sinks and Integrated Micropumps

3. Heat Transfer in Microchannels—2012 Status and Research Needs

4. Comparison of Micro-Pin-Fin and Microchannel Heat Sinks Considering Thermal-Hydraulic Performance and Manufacturability

5. Comparative Study of Thermal Performance of Longitudinal and Transversal-Wavy Microchannel Heat Sinks for Electronic Cooling

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. SiC Microchannel Heat Sinks for High Heat Flux Dissipation of 1 kW/cm²;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-05

2. High-performance energy-saving miniature loop heat pipe for cooling compact power semiconductors;Energy Conversion and Management;2021-05

3. Development and performance comparison of valveless piezoelectric pumps with asymmetrical channels;Sensors and Actuators A: Physical;2020-10

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