Strategies for Optimal Chemical Mechanical Polishing (CMP) Slurry Design-Reference-Cited by-同舟云学术

Strategies for Optimal Chemical Mechanical Polishing (CMP) Slurry Design

Published:2003-01-07 Issue:3-4 Volume:24 Page:499-515
ISSN:0193-2691
Container-title:Journal of Dispersion Science and Technology
language:en
Short-container-title:Journal of Dispersion Science and Technology

Author:

Bahar Basim G.¹,Brown Scott C.¹,Vakarelski Ivan U.¹,Moudgil Brij M.¹

Affiliation:

1. a Department of Materials Science and Engineering and Engineering Research Center for Particle Science and Technology , University of Florida , 205 Particle Science and Technology Building, P.O. Box 116135, Gainesville , Florida , 32611‐6135 , USA

Publisher

Informa UK Limited

Subject

Polymers and Plastics,Surfaces, Coatings and Films,Physical and Theoretical Chemistry

Link

https://www.tandfonline.com/doi/pdf/10.1081/DIS-120021805

Reference36 articles.

1. Fundamentals of Slurry Design for CMP of Metal and Dielectric Materials

2. Basic Science in Silica Glass Polishing

3. Effect of Soft Agglomerates on CMP Slurry Performance

4. Effect of Particle Size of Chemical Mechanical Polishing Slurries for Enhanced Polishing with Minimal Defects

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