Metal‐assisted chemical etching for realisation of deep silicon microstructures
Author:
Affiliation:
1. Thin Film LaboratorySchool of Electrical and Computer EngineeringCollege of EngineeringUniversity of TehranTehranIran
2. Applied Spintronics GroupPhysics DepartmentUniversity of GothenburgGothenburgSweden
Publisher
Institution of Engineering and Technology (IET)
Subject
Condensed Matter Physics,General Materials Science,Biomedical Engineering,Bioengineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/mnl.2019.0113
Reference20 articles.
1. LaermerF.SchilpA.: ‘Method of anisotropically etching silicon’ US Patent 1996 26 (3) p.5501893
2. Low‐temperature reactive ion etching and microwave plasma etching of silicon
3. Cryogenic Etching of Silicon: An Alternative Method for Fabrication of Vertical Microcantilever Master Molds
4. Deep Vertical Etching of Silicon Wafers Using a Hydrogenation-Assisted Reactive Ion Etching
5. Formation of three-dimensional and nanowall structures on silicon using a hydrogen-assisted high aspect ratio etching
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Double-layered subwavelength metallic slit array for performance-improvement of a fiber-optic silicon Fabry–Perot temperature sensor;Optical and Quantum Electronics;2024-05-10
2. Voltage‐ and Metal‐assisted Chemical Etching of Micro and Nano Structures in Silicon: A Comprehensive Review;Small;2024-04-21
3. 基于皮秒激光的石墨表面亚微结构加工方法;Laser & Optoelectronics Progress;2024
4. Research Progress of Antireflective Metal Surfaces Prepared by Ultrafast Laser;CHINA SURF ENG;2021
5. Structuring of Si into Multiple Scales by Metal‐Assisted Chemical Etching;Advanced Materials;2021-05-19
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3