Systematic study of the etching characteristics of Si{111} in modified TMAH-Reference-Cited by-同舟云学术

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Systematic study of the etching characteristics of Si{111} in modified TMAH

Published:2020-01 Issue:1 Volume:15 Page:52-57
ISSN:1750-0443
Container-title:Micro & Nano Letters
language:en
Short-container-title:Micro & Nano Letters

Author:

Swarnalatha Veerla¹,Pal Prem¹,Pandey Ashok Kumar²,Narasimha Rao Avvaru Venkata¹,Xing Yan³,Tanaka Hiroshi⁴,Sato Kazuo⁴

Affiliation:

1. MEMS and Micro/Nano Systems LaboratoryDepartment of PhysicsIndian Institute of Technology HyderabadHyderabadTelanganaIndia

2. Department of Mechanical and Aerospace EngineeringIndian Institute of Technology HyderabadHyderabadTelanganaIndia

3. Department of Mechanical EngineeringSoutheast UniversityNanjingPeople's Republic of China

4. Deptartment of Mechanical EngineeringAichi Institute of TechnologyAichiJapan

Publisher

Institution of Engineering and Technology (IET)

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,Bioengineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/mnl.2019.0443

Reference50 articles.

1. Silicon Wet Bulk Micromachining for MEMS

2. Formation of ultra-smooth 45° micromirror on (100) silicon with low concentration TMAH and surfactant: Techniques for enlarging the truly 45° portion

3. Silicon Micromachining Based on Surfactant-Added Tetramethyl Ammonium Hydroxide: Etching Mechanism and Advanced Applications

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. High Speed Etching of Silicon in NaOH-Based Solution;Springer Proceedings in Physics;2024

2. Wet anisotropic etching characteristics of Si{111} in NaOH-based solution for silicon bulk micromachining;Micro and Nano Systems Letters;2022-12-01

3. Etching Characteristics of Si{110} in NaOH Based Solution;Microactuators, Microsensors and Micromechanisms;2022-11-21

4. Enhanced etching characteristics of Si{100} in NaOH-based two-component solution;Micro and Nano Systems Letters;2022-08-01

5. High speed silicon wet anisotropic etching for applications in bulk micromachining: a review;Micro and Nano Systems Letters;2021-02-22

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