Pull‐in analysis of microbeam laminated with LASMP-Reference-Cited by-同舟云学术

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Pull‐in analysis of microbeam laminated with LASMP

Published:2020-05 Issue:6 Volume:15 Page:378-383
ISSN:1750-0443
Container-title:Micro & Nano Letters
language:en
Short-container-title:Micro & Nano Letters

Author:

Guo Jun¹,Yang Yunze²^ORCID,Zhai Haorui¹

Affiliation:

1. School of Automotive EngineeringYancheng Institute of TechnologyYanchengJiangsu224051People's Republic of China

2. School of Mechanical and Electrical EngineeringGuilin University of Electronic TechnologyGuilinGuangxi541004People's Republic of China

Publisher

Institution of Engineering and Technology (IET)

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,Bioengineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/mnl.2019.0754

Reference32 articles.

1. Reliability testing of flexible printed circuit-based RF MEMS capacitive switches

2. OsterbergP.M.: ‘Electrostatically actuated micromechanical test structure for material property measurement’. PhD dissertation Massachusetts Institute of Technology 1995

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Nature frequency manipulation of plates laminated with LASMP via Ritz method;Ferroelectrics;2021-10-03

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