Transmission characteristics of multi‐walled carbon nanotube‐based through‐silicon vias considering temperature effects-Reference-Cited by-同舟云学术

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Transmission characteristics of multi‐walled carbon nanotube‐based through‐silicon vias considering temperature effects

Published:2017-07-04 Issue:10 Volume:11 Page:1424-1431
ISSN:1751-8733
Container-title:IET Microwaves, Antennas & Propagation
language:en
Short-container-title:IET Microwaves, Antennas & Propagation

Author:

Su Jinrong¹,Chen Xinwei¹,Han Liping¹,Yang Rongcao¹,Zhang Wenmei¹

Affiliation:

1. College of Physics and ElectronicsShanxi UniversityShanxi030006People's Republic of China

Funder

National Natural Science Foundation of China

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/iet-map.2016.0497

Reference24 articles.

1. Circuit Modeling and Performance Analysis of Multi-Walled Carbon Nanotube Interconnects

2. Carbon Nanomaterials for Next-Generation Interconnects and Passives: Physics, Status, and Prospects

3. Current Saturation and Electrical Breakdown in Multiwalled Carbon Nanotubes

4. Thermal stability of single and multi-walled carbon nanotubes

5. High‐frequency scalable electrical model and analysis of a through silicon via (TSV);Kim J.;IEEE Trans. Compon. Packag. Technol.,2011

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The design and optimization of novel elliptic cylindrical through‐silicon via and its temperature characterization;Engineering Reports;2022-02-23

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