The design and optimization of novel elliptic cylindrical through‐silicon via and its temperature characterization
Author:
Affiliation:
1. Key Laboratory of Wide Band‐Gap Semiconductor Materials and Devices Xidian University Xi'an China
Publisher
Wiley
Subject
General Medicine
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/eng2.12470
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1. A Short Review of Through-Silicon via (TSV) Interconnects: Metrology and Analysis;Applied Sciences;2023-07-18
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