Modelling of crosstalk in differential through silicon vias for three‐dimensional integrated circuits-Reference-Cited by-同舟云学术

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Modelling of crosstalk in differential through silicon vias for three‐dimensional integrated circuits

Published:2019-05-14 Issue:10 Volume:13 Page:1529-1535
ISSN:1751-8733
Container-title:IET Microwaves, Antennas & Propagation
language:en
Short-container-title:IET Microwaves, Antennas & Propagation

Author:

Pan Jin‐Wei¹,Fu Kai¹,Liu Qi¹,Zhao Wen‐Sheng¹^ORCID,Dong Linxi¹,Wang Gaofeng¹^ORCID

Affiliation:

1. Key Laboratory of RF Circuits and Systems of Ministry of EducationSchool of Electronics and InformationHangzhou Dianzi UniversityHangzhou310018People's Republic of China

Funder

National Natural Science Foundation of China

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/iet-map.2018.5297

Reference17 articles.

1. Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs

2. High-Speed Design and Broadband Modeling of Through-Strata-Vias (TSVs) in 3D Integration

3. Compact AC Modeling and Performance Analysis of Through-Silicon Vias in 3-D ICs

4. TSV-Aware Interconnect Distribution Models for Prediction of Delay and Power Consumption of 3-D Stacked ICs

5. Through-Strata-Via (TSV) Parasitics and Wideband Modeling for Three-Dimensional Integration/Packaging

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1. Technology review of CNTs TSV in 3D IC and 2.5D packaging: Progress and challenges from an electrical viewpoint;Microelectronic Engineering;2024-07

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