Online task scheduler in 3D‐MCPs with TADVA-Reference-Cited by-同舟云学术

Online task scheduler in 3D‐MCPs with TADVA

Published:2018-01-04 Issue:2 Volume:12 Page:44-52
ISSN:1751-8601
Container-title:IET Computers & Digital Techniques
language:en
Short-container-title:IET Computers & Digital Techniques

Author:

Liao Chien‐Hui¹^ORCID,Wen Charles Hung‐Pin²

Affiliation:

1. Institute of Communications EngineeringDepartment of Electrical and Computer EngineeringNational Chiao Tung University1001 University RoadHsinchuTaiwan

2. Department of Electrical and Computer EngineeringNational Chiao Tung University1001 University RoadHsinchuTaiwan

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/iet-cdt.2017.0014

Reference27 articles.

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3. Puttaswamy K. Loh G.H.: ‘Thermal analysis of a 3D die‐stacked high‐performance microprocessor’.Proc. ACM Great Lakes Symp. VLSI GLSVLSI 2006 pp.19–24

4. Hung W.L. Link G. Xie Y. et al.: ‘Interconnect and thermal‐aware floorplanning for 3D microprocessors’.Proc. Int. Symp. Quality Electronic Design (ISQED) March2006 pp.98–104

5. Hu Y. Chen S. Peng L. et al.: ‘Effective thermal control techniques for liquid‐cooled 3D multi‐core processors’.Proc. Int. Symp. Quality Electronic Design (ISQED) March2013 pp.8–15