Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits-Reference-Cited by-同舟云学术

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits

Published:2016-06 Issue:3 Volume:33 Page:21-36
ISSN:2168-2356
Container-title:IEEE Design & Test
language:
Short-container-title:IEEE Des. Test

Author:

Coudrain Perceval,Souare Papa Momar,Prieto Rafael,Fiori Vincent,Farcy Alexis,Le Pailleur Laurent,Colonna Jean-Philippe,Santos Cristiano,Vivet Pascal,Ben-Jamaa Haykel,Dutoit Denis,de Crecy Francois,Dumas Sylvain,Chancel Christian,Lattard Didier,Cheramy Severine

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Software

Link

http://xplorestaging.ieee.org/ielx7/6221038/7462312/07350123.pdf?arnumber=7350123

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2. Efficient Thermal-Stress Coupling Design of Chiplet-Based System with Coaxial TSV Array;Micromachines;2023-07-25

3. Thermal Performance Analysis of Carbon Materials Based TSV in Three Dimensional Integrated Circuits;IEEE Access;2023

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5. HotCluster: A thermal-aware defect recovery method for Through-Silicon-Vias Towards Reliable 3-D ICs systems;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2021