Affiliation:
1. Department of Information TechnologyIndian Institute of Engineering Science and TechnologyShibpurHowrahWest BengalIndia
Funder
University Grants Commission
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Reference23 articles.
1. Design space exploration for 3D architectures
2. Demystifying 3D ICs: The Pros and Cons of Going Vertical
3. Weerasekera R. Zheng L.R. Pamunuwa D. Tenhunen H.: ‘Extending systems‐on‐chip to the third dimension: performance cost and technological tradeoffs’.Int. Conf. on Computer‐Aided Design 2007 pp.212–219
4. Test challenges for 3D integrated circuits;Lee H.S.;IEEE Design Test Comput., Special Issue on 3D IC Design and Test,2009
5. Processor design in 3D die‐stacking technologies;Loh H.;Proc. IEEE Micro,2007