Temperature control in three‐network on chips using task migration
Author:
Affiliation:
1. Department of Computer EngineeringSharif University of TechnologyTehranIran
2. Department of Electrical and Computer EngineeringUniversity of TorontoTorontoCanada
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/iet-cdt.2013.0016
Reference28 articles.
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3. Chao C.H. Jheng K.Y. Wang H.Y. Wu J.C. Wu A.Y.: ‘Traffic and thermal‐aware run‐time thermal management scheme for 3D NoC systems’.Proc. Fourth ACM/IEEE Int. Symp. on Networks‐on‐Chip May2010 pp.223–230
4. Wang H. Fu Y. Liu T. Wang J.: ‘Thermal management via task scheduling for 3D NoC based multi‐processor’.Int. SoC Design Conf. November2010 pp.440–444
5. Black B. Amavaram M. Brekelbaum N.: ‘Die stacking (3D) microarchitecture’.Proc. IEEE/ACM Int. Symp. on Microarchitecture (Micro'06) December2006
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1. Thermal management in 3d networks-on-chip using dynamic link sharing;Microprocessors and Microsystems;2017-07
2. A novel mapping algorithm for three-dimensional network on chip based on quantum-behaved particle swarm optimization;Frontiers of Computer Science;2017-03-17
3. Thermal-Aware 3D Network-On-Chip (3D NoC) Designs: Routing Algorithms and Thermal Managements;IEEE Circuits and Systems Magazine;2015
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