DC and RF characteristics of In 0.52 Al 0.48 As/In 0.7 Ga 0.3 As HEMTs at 300 and 16 K
Author:
Affiliation:
1. National Institute of Information and Communications Technology4‐2‐1 Nukui‐kitamachiKoganeiTokyo184‐8795Japan
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/el.2012.4180
Reference6 articles.
1. Velocity enhancement in cryogenically cooled InP‐based HEMTs on (411)A‐oriented substrates;Watanabe I.;IEEE Trans. Electron Devices,2006
2. Novel high‐yield trilayer resist process for 0.1 µm T‐gate fabrication;Wakita A.S.;J. Vac. Sci. Technol. B,1995
3. Short-channel effects in subquarter-micrometer-gate HEMTs: simulation and experiment
4. Fabrication technology and device performance of sub‐50‐nm‐gate InP‐based high electron mobility transistors;Endoh A.;Jpn. J. Appl. Phys.,2002
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1. Nanoscale dual-gate InAlAs/InGaAs HEMT with improved characteristics;International Journal of Electronics Letters;2019-03-04
2. Design and Simulation of AlGaAs/InGaAs/GaAs Based Pseudomorphic HEMT Using SILVACO ATLASTM;2018 2nd International Conference on Data Science and Business Analytics (ICDSBA);2018-09
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