Simultaneous switching noise mitigation in PCB using cascaded high-impedance surfaces
Author:
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://digital-library.theiet.org/content/journals/10.1049/el_20040077?crawler=true&mimetype=application/pdf
Reference4 articles.
1. Power-bus decoupling with embedded capacitance in printed circuit board design
2. A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface
3. Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits
4. Sievenpiper, D.F.: ‘High-impedance electromagnetic surfaces’, 1999, PhD, UCLA, Department of Electrical Engineering, Los Angeles, CA
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