Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,General Computer Science
Reference34 articles.
1. J. Lau, C. Wong, J. Prince, W. Nakayama, Electronic Packaging: Design, Materials, Process, and Reliability (McGraw-Hill, New York, 1998)
2. G.-T. Lei, R.W. Techentin, B.K. Gilbert, High-frequency characterization of power/ground-plane structures. IEEE Trans. Microw. Theory Tech. 47, 562–569 (1999)
3. S. Shahparnia, O.M. Ramahi, Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures. IEEE Trans. Electromagn. Compat. 46(4), 580–587 (2004)
4. R., Abhari, G.V., Eleftheriades, Suppression of the parallel-plate noise in high-speed circuits using a metallic electromagnetic band-gap structure. in Proceedings IEEE MTT-S Int. Microwave Symposium, 1, 493–496 (2002)
5. T. Kamgaing, O.M. Ramahi, A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface. IEEE Microw.Wireless Compon. Lett. 13(1), 21–23 (2003)