Post-breakdown oxide voltage oscillation in thin SiO2 under nano-scaled repetitive ramped voltage stress
Author:
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://digital-library.theiet.org/content/journals/10.1049/el_20063577?crawler=true&mimetype=application/pdf
Reference10 articles.
1. Current limited stresses of SiO/sub 2/ gate oxides with conductive atomic force microscope
2. Electrical characterization of stressed and broken down SiO2 films at a nanometer scale using a conductive atomic force microscope
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1. Influence of the surrounding ambient on the reliability of the electrical characterization of thin oxide layers using an atomic force microscope;Microelectronics Reliability;2011-12
2. Study of the physical and electrical degradation of thin oxide films by atomic force microscope;Journal of Vacuum Science & Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phenomena;2011-01
3. Improvement in the Cumulative Failure Distribution of High-kDielectric Subjected to Nanoscale Stress by D2Post-Deposition Annealing;Japanese Journal of Applied Physics;2009-11-20
4. Time-to-Breakdown Weibull Distribution of Thin Gate Oxide Subjected to Nanoscaled Constant-Voltage and Constant-Current Stresses;IEEE Transactions on Device and Materials Reliability;2008-06
5. Thin Gate Oxide Reliability Study Using Nano-Scaled Stress;2007 IEEE Conference on Electron Devices and Solid-State Circuits;2007
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