Comparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames-Reference-Cited by-同舟云学术

Comparative study on the thermal performance of surface‐mounted devices light‐emitting diode packaging with poly(1,4‐cyclohexylenedimethylene terephthalate) and epoxy moulding compound frames

Published:2021-05-26 Issue:1 Volume:16 Page:1-9
ISSN:1751-8768
Container-title:IET Optoelectronics
language:en
Short-container-title:IET Optoelectronics

Author:

Zhao Dezhi¹,Xiong Zhihua¹^ORCID,Chen Cong¹,Niu Yunfei²

Affiliation:

1. Key Laboratory for Optoelectronics and Communication of Jiangxi Province Jiangxi Science and Technology Normal University Nanchang China

2. The State Key Laboratory of Integrated Optoelectronics College of Electronic Science and Engineering, Jilin University Changchun China

Funder

National Natural Science Foundation of China

Major Discipline Academic and Technical Leaders Training Program of Jiangxi Province

Natural Science Foundation of Jiangxi Province

Publisher

Institution of Engineering and Technology (IET)

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1049/ote2.12044

Reference31 articles.

1. Solid-State Light Sources Getting Smart

2. Dynamic Optical Power Measurements and Modeling of Light-Emitting Diodes Based on a Photodetector System and Photo-Electro-Thermal Theory

3. Review of Optical Designs for Light-Emitting Diode Packaging

4. Advanced thermal enhancement and management of LED packages

5. Bondability of Pd and Au Containing Ag-Alloy Wires on Au Pads for LED Package

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