Substrate cross‐talk analysis flow for submicron CMOS system‐on‐chip
Author:
Affiliation:
1. Intel Mobile Communications GmbH (Intel Corporation)Am Campeon 1085579NeubibergGermany
Publisher
Institution of Engineering and Technology (IET)
Subject
Electrical and Electronic Engineering
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1049/el.2015.0563
Reference6 articles.
1. Substrate noise coupling mechanisms in lightly doped CMOS transistors;Bronckers S.;IEEE Trans. Instrum. Meas.,2010
2. Clement F.: ‘Method and apparatus for assisting integrated circuit designing with a substrate coupling’. Patent number: 8306803 6 November2012 Assignee: Coupling Wave Solutions CWS
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