Effect of Indium on Microstructure, Mechanical Properties, Phase Stability and Atomic Diffusion of Sn-0.7cu Solder: Experiments and First-Principles Calculations

Author:

Yang AnCang,Xiao Kunxuan,Duan Yong Hua,Li Caiju,Yi Jianhong,Peng Minjun,Shen Li

Publisher

Elsevier BV

Subject

General Earth and Planetary Sciences,General Environmental Science

Reference60 articles.

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3. Intermetallic growth and mechanical behavior of low and high melting temperature solder alloys;D R Frear;Metall. Mater. Trans,1994

4. High-temperature lead-free solders: properties and possibilities;K Suganuma;J. Occup. Med,2009

5. High-temperature lead-free solder alternatives;V Chidambaram;Microelectron. Eng,2011

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