Author:
Ojha Manish,Mohammed Yousuf,Stone Donlad,Elmustafa A.A.
Reference28 articles.
1. Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability;M B Kelly;Journal of Electronic Materials,2020
2. Effect of Thermal Aging on The Interfacial Structure of SnAgCu Solder Joints on Cu;W Peng;Microelectronics Reliability,2007
3. Advances in Lead-Free Electronics Soldering;K Suganuma;Current Opinion in Solid State and Materials Science,2001
4. Interfacial Reaction of Sn-Ag-Cu Lead-Free Solder Alloy on Cu: A Review;L M Lee;Advances in Materials Science and Engineering,2013
5. Effects of Intermetallic Compounds on Properties of Sn-Ag-Cu Lead-Free Soldered Joints;K S Kim;Journal of Alloys and Compounds,2003