The Evolution of Compounds Growth between Sn-3.5Ag and Co-P Films with Different Phosphorous Contents-Reference-Cited by-同舟云学术

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The Evolution of Compounds Growth between Sn-3.5Ag and Co-P Films with Different Phosphorous Contents

Published:2021 Issue: Volume: Page:
ISSN:1556-5068
Container-title:SSRN Electronic Journal
language:en
Short-container-title:SSRN Journal

Author:

Liu Shuang,Ma Limin,Wang Yishu,Zhen Cheng,Li Dan,Guo Fu

Publisher

Elsevier BV

Subject

General Earth and Planetary Sciences,General Environmental Science

Reference49 articles.

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2. Advances in lead-free electronics soldering, Current Opinion in Solid State;K Suganuma;Materials Science,2001

3. Flip-Chip (FC) and Fine-Pitch-Ball-Grid-Array (FPBGA) Underfills for Application in Aerospace ElectronicsBrief Review;E Suhir;Aerospace,2018

4. Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate;J C Gong;Acta Materialia,2008

5. Intermetallic compound formation between Sn-3.5Ag solder and Ni-based metallization during liquid state reaction;M He;Thin Solid Films,2004

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