The Exploration of Lapping Sapphire with Diamond-Ceo2 Chemically Active Abrasives Cluster

Author:

Wang Zhankui,Huang Shangci,Liu Kuncheng,Zhao Zhicheng,Feng Wei,Pang Minghua,Su Jianxiu

Publisher

Elsevier BV

Reference45 articles.

1. Thematic analysis of sustainable ultra-precision machining by using text mining and unsupervised learning method;H Zhou;J. Manuf. Systems,2022

2. Research on quality control of precision machining straight internal gear by abrasive flow based on large eddy simulation;T Zou;The International Journal of Advanced Manufacturing Technology,2022

3. Nanoscale removal mechanism for abrasive particle processing of brittle materials;S Huang;Diamond & Abrasives Engineering,2022

4. Atomicscale surface of fused silica induced by chemical mechanical polishing with controlled size spherical ceria abrasives;G Xu;J. Manuf. Process,2023

5. Study of the humidity-controlled CeO 2 fixed-abrasive chemical mechanical polishing of a single crystal silicon wafer;G Li;Tribology International,2023

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