Author:
Sung Hyun-Min,Lee Siwhan,Lee Dongkyu,Kim Hwangsun,Kang Sung-Gyu,Lee Gun-Do,Jeong Kyeongjae,Han Heung Nam
Reference56 articles.
1. Thermodynamic properties of the Cu-Al system: correlation with bonding mechanisms;J Hair;Faraday Symposia of the Chemical Society,1973
2. The aluminium-copper system;J L Murray;International metals reviews,1985
3. Experimental description of the Al-Cu binary phase diagram;O Zobac;Metallurgical and Materials Transactions A,2019
4. Combinatorial investigation of Al-Cu intermetallics using small-scale mechanical testing;Y Xiao;Journal of Alloys and Compounds,2020
5. Interfacial reactions between lead-free solders and common base materials;T Laurila;Materials Science and Engineering: R: Reports,2005