Mechanical properties of Cu/In-48 Sn/Cu diffusion-soldered joints-Reference-Cited by-同舟云学术

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Mechanical properties of Cu/In-48 Sn/Cu diffusion-soldered joints

Published:2002-06 Issue:6 Volume:93 Page:496-501
ISSN:0044-3093
Container-title:Zeitschrift für Metallkunde
language:en
Short-container-title:MEKU

Author:

Sommadossi S.,Huici J.,Khanna P. K.,Gust W.,Mittemeijer E. J.

Publisher

Walter de Gruyter GmbH

Subject

Metals and Alloys

Reference16 articles.

1. Humpston, G.; Jacobson, D.M.: Principles of Soldering and Brazing, ASM International, Materials Park, OH (1993) 128.

2. Advances in lead-free electronics soldering

3. Lead-free Solders in Microelectronics

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