Flotation Separation of SiC from Wastes in the Silicon Wafer Slicing Process-Reference-Cited by-同舟云学术

Flotation Separation of SiC from Wastes in the Silicon Wafer Slicing Process

Published:2006 Issue:1 Volume:32 Page:93-98
ISSN:0386-216X
Container-title:KAGAKU KOGAKU RONBUNSHU
language:en
Short-container-title:KAGAKU KOGAKU RONBUNSHU

Author:

Shibata Junji¹,Murayama Norihiro¹,Nagae Kengo¹

Affiliation:

1. Department of Chemical Engineering, Faculty of Engineering, Kansai University

Publisher

Society of Chemical Engineers, Japan

Subject

General Chemical Engineering,General Chemistry

Link

http://www.jstage.jst.go.jp/article/kakoronbunshu/32/1/32_1_93/_pdf

Reference7 articles.

1. Interfacial processes in mineral/water systems

2. On using electrokinetics to interpret the flotation and interfacial behavior of manganese dioxide

3. Kusaka, E., S. Yano, Y. Fukunaka and R. Ishii; “Fundamental Study on Separation of Silicon Compound Particles with Flotation” (in Japanese), Proc. MMIJ Annual Meeting 2003, II, pp. 83–84, Tokyo, Japan (2003)

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