Copper film formation on metal surfaces with 100 W blue direct diode laser system-Reference-Cited by-同舟云学术

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Copper film formation on metal surfaces with 100 W blue direct diode laser system

Published:2018-08 Issue:3 Volume:30 Page:032602
ISSN:1042-346X
Container-title:Journal of Laser Applications
language:en
Short-container-title:Journal of Laser Applications

Author:

Asano Kohei¹²,Tsukamoto Masahiro³,Funada Yoshinori⁴,Sakon Yu⁵,Abe Nobuyuki³,Sato Yuji³,Higashino Ritsuko³,Sengoku Masanori⁶,Yoshida Minoru⁶

Affiliation:

1. Graduate School of Engineering, Osaka University, Osaka 565-0871, Japan

2. Yamazaki Mazak Corporation, Aichi 480-0197, Japan

3. Joining and Welding Research Institute, Osaka University, Osaka 567-0047, Japan

4. Industrial Research Institute of Ishikawa, Ishikawa 920-8203, Japan

5. Muratani Machine Manufacture Co., Ltd., Ishikawa 920-0209, Japan

6. Graduate School of Science and Engineering, Kindai University, Osaka 577-8502, Japan

Publisher

Laser Institute of America

Subject

Instrumentation,Biomedical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Link

http://lia.scitation.org/doi/pdf/10.2351/1.5040635

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1. Achieving high robust laser conduction welding and enhanced joint conductivity in pure copper foil stacks using a flat-top blue laser;Optics & Laser Technology;2024-07

2. Study of Pure Copper Layer Formation with a Multi-Beam Laser Cladding System in Flight Powder Melting Conditions;Journal of Smart Processing;2024-05-10

3. Effect of overlap rate on the microstructure and corrosion behavior of pure copper laser cladding;Journal of Materials Science;2024-03-24

4. Pure copper layer coating with multibeam laser metal deposition system with blue diode lasers;Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX;2024-03-12

5. Formation of a low-dilution pure copper layer by wire-based laser metal deposition with blue diode laser;Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXIX;2024-03-12

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