Study of Pure Copper Layer Formation with a Multi-Beam Laser Cladding System in Flight Powder Melting Conditions
Author:
Affiliation:
1. OSAKA FUJI CORPORATION
2. Joining and Welding Research Institute, Osaka University
Publisher
Sumart Processing Society for Minerals, Environment and Energy
Link
https://www.jstage.jst.go.jp/article/jspmee/13/3/13_135/_pdf
Reference16 articles.
1. 1) S. Suzuki, K. Miyakusu, Y. Sato, Y. Kikuchi and H. Kawakami: “Antimicrobiability of Cu Contained Stainless Steels”, Tetsu-to- Hagané, 100-8 (2014), 97-104.
2. 2) A. Mikolay, S. Huggett, L. Tikana, G. Grass, J. Braun and D.H. Nies: “Survival of bacteria on metallic copper surfaces in a hospital trial”, Microbiol Biotechnol, 87 (2010), 1875-1879.
3. 3) Japan Welding Society: “Welding Handbook (Revision 3)”, Maruzen Publishing Co., Ltd., (1990), 492.
4. 4) S. Oki and K. Ueno: “Thermal spray technology handbook”, Japan Thermal Spray Society, (2017).
5. 5) D.J. Greving, J.R. Shadley, E.F. Rybicki, D.J. Greving, J.R. Shadley and E.F. Rybicki: “Effects of coating thickness and residual stresses on the bond strength of ASTM C633-79 thermal spray coating test specimens”, Journal of Thermal Spray Technology, 3 (1994), 371- 378.
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