Investigation of precession laser machining of microholes in aerospace material

Author:

Le Hoang1,Nasrollahi Vahid1ORCID,Karkantonis Themistoklis1ORCID,Penchev Pavel1,Marimuthu Sundar2ORCID,Crozier Mickey2,Dimov Stefan1ORCID

Affiliation:

1. Department of Mechanical Engineering, University of Birmingham 1 , Birmingham B15 2TT, United Kingdom

2. The Manufacturing Technology Centre Ltd 2 , Coventry CV7 9JU, United Kingdom

Abstract

Sidewall tapering is one of the main limitations in ultrashort pulse (USP) laser machining and is associated with the beam shape and self-limiting effect. Laser processing with a precession beam is a potential solution to overcome this limitation. A study into the effects of precession parameters on the taper angle in microhole drilling of a nickel alloy is reported in this paper. The effects of three key precession parameters, i.e., incident angle, relative distance between the focuses of the precession and individual beams, and scanning speed, have been investigated in detail. Experiments were performed to drill through holes with aspect ratios up to 20:1 and diameters ranging from 100 to 500 μm over 0.6–2 mm thick nickel alloy substrates. Experiment results showed that all the considered parameters/factors were significant and affected the hole tapering in different ways. In addition, there were important interaction effects between two of the factors, i.e., incident angle and focus position, in some cases. The optimal parameters to minimize the tapering effect are suggested, and the mechanism is discussed in detail. The precession laser machining showed clear advantages in overcoming the limitations to associated with conventional USP laser machining. Fabricating microholes with high geometrical accuracy, i.e., with straight side walls and zero taper angles, is feasible with the use of a precession beam. The results clearly show the potential of precession laser processing and the capabilities that the technology can offer for a range of laser micromachining applications in different industries, such as microelectronics, automotive, and aerospace.

Funder

UKRI Future Leaders Fellowship

European Structural Investment Funds

Publisher

Laser Institute of America

Subject

Instrumentation,Biomedical Engineering,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference37 articles.

1. Laser beam micro drilling—A review;Lasers Manuf. Mater. Process.,2018

2. LIDE high aspect ratio glass processing technology for the mass production of microfluidic devices for biomedical applications,2019

3. A review on laser drilling and cutting of silicon;J. Eur. Ceram. Soc.,2021

4. Laser processing of medical devices,2015

5. Characteristics of micro-hole formation during fibre laser drilling of aerospace superalloy;Precis. Eng.,2019

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3