Measurements of thermal conductivity and the coefficient of thermal expansion for polysilicon thin films by using double-clamped beams-Reference-Cited by-同舟云学术

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Measurements of thermal conductivity and the coefficient of thermal expansion for polysilicon thin films by using double-clamped beams

Published:2017-12-12 Issue:1 Volume:28 Page:015010
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Liu Haiyun^ORCID,Wang Lei

Funder

The Fundamental Research Funds for the Central Universities

Natural Science Foundation of Jiangsu Province

National Natural Science Foundation of China

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://iopscience.iop.org/article/10.1088/1361-6439/aa9d29/pdf

Reference27 articles.

1. Out-of-Plane CTE Measurement Method for Freestanding Thin Films

2. CMOS-Compatible Surface-Micromachined Test Structure for Determination of Thermal Conductivity of Thin Film Materials based on Seebeck Effect

3. Thin-Film Thermal Conductivity Measurement Using Microelectrothermal Test Structures and Finite-Element-Model-Based Data Analysis

4. Compact Test Structure to Measure All Thermophysical Properties for the In-Plane Figure of Merit ZT of Thin Films

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