Three-axis force sensor miniaturized by 3D microstructuring using high-temperature punch creep-forming process
Author:
Funder
JSPS KAKENHI
Publisher
IOP Publishing
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
https://iopscience.iop.org/article/10.1088/1361-6439/abd223/pdf
Reference43 articles.
1. Force and Acceleration Sensor Fusion for Compliant Robot Motion Control
2. Dynamic contact force/torque observer: Sensor fusion for improved interaction control
3. Gait Analysis Using Wearable Sensors
4. A Multiaxis Force Sensor for the Study of Insect Biomechanics
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1. Crystallographic orientation dependence in creep deformation of micron-thick silicon films for 3-D microstructures;Sensors and Actuators A: Physical;2024-12
2. Crystallographic Orientation Dependence in Creep Deformation of Micron-Thick Silicon Films for 3-D Microstructures;2024
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