Improved anchor design for flat MEMS structure by suppressing deformation due to buried-oxide stress on silicon-on-insulator wafer
Author:
Publisher
IOP Publishing
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Link
https://iopscience.iop.org/article/10.1088/1361-6439/abe09b/pdf
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4. Sub-micro-gravity in-plane accelerometers with reduced capacitive gaps and extra seismic mass;Abdolvand;J. Microelectromech. Syst.,2007
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1. Stress Reduction by Indirect Bonding Configuration;2024 IEEE International Symposium on Inertial Sensors and Systems (INERTIAL);2024-03-25
2. Stress Isolation Suspension for Silicon-on-Insulator 3-Axis Accelerometer Designed by Topology Optimization Method;IEEE Sensors Journal;2022-03-01
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