Abstract
Abstract
In this letter we present an MEMS Sensor to measure displacement in at least two directions. The sensor device is a resonant, Lorentz force driven and cross-shaped sensing structure whereas the measurement signal equals the change of the resonance frequency induced by the deformation of the sensor-frame. This device is a pre-study to implement the sensor in a two-dimensional micro manipulation system for which the team uses a micro system analyzer to detect the resonance frequencies of the different vibration modes. The sensor-frame deformation between 0.1 and 2 µm is generated by four piezo actuators. With this setup, the sensor achieves a sensitivity of up to 20 nm Hz−1. The device is fabricated from a 100 mm SOI wafer with standard CMOS processes and has two Pt1000 elements integrated on the device layer to compensate any effects caused by thermal extension of the structure or temperature induced changes of material parameters.
Funder
Microfunding - University of Technology Vienna
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
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