Abstract
Abstract
In this paper, the simple, rejection-based kinetic Monte Carlo simulation method is applied for the approximate simulation of the etch rates and three-dimensional etch structures during anisotropic wet etching of sapphire. Based on the analysis of the composition of the atomic structure of sapphire, a model of the simplified atomic structure of sapphire is proposed, which reduces the difficulty of classifying types of surface atoms on the different crystallographic planes. This enables adopting a previously proposed six-index classification method (to differentiate effectively between the various surface atoms of sapphire) and a previously proposed removal probability function (RPF) (to link the removal probability of the surface atom with the configuration of its neighbors). By reducing errors between simulated rates and experimental rates of 11 typical crystallographic planes in the <−1 1 0 0> and <1 1 −2 0> crystallographic zones continuously with an evolutionary algorithm, reasonable values of nine energy parameters of the RPF are obtained. The simulated results describe approximately the experimental counterparts.
Funder
National Key Research and Development Program of China
National Natural Science Foundation of China
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Cited by
9 articles.
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