Thin film encapsulation for flexible AM-OLED: a review-Reference-Cited by-同舟云学术

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Thin film encapsulation for flexible AM-OLED: a review

Published:2011-02-14 Issue:3 Volume:26 Page:034001
ISSN:0268-1242
Container-title:Semiconductor Science and Technology
language:
Short-container-title:Semicond. Sci. Technol.

Author:

Park Jin-Seong,Chae Heeyeop,Chung Ho Kyoon,Lee Sang In

Publisher

IOP Publishing

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

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