Thermal interface materials: opportunities and challenges for developers-Reference-Cited by-同舟云学术

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Thermal interface materials: opportunities and challenges for developers

Published:2015-07-08 Issue:2 Volume:2 Page:020301
ISSN:2053-1613
Container-title:Translational Materials Research
language:
Short-container-title:Transl. Mater. Res.

Author:

Gordon Rachel

Publisher

IOP Publishing

Link

http://stacks.iop.org/2053-1613/2/i=2/a=020301/pdf

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Towards high-performance polydimethylsiloxane-based materials for thermal management: A molecular dynamics study;International Communications in Heat and Mass Transfer;2024-11

2. Experimental study of thermal contacts for the enhancement of interfacial heat transfer;Engineering Research Express;2024-05-14

3. Experimental studies on selected thermal interface materials;Thermal Science;2024

4. Low‐Temperature Solidifiable Liquid Metal with Ultrahigh Thermal Conductivity Enabled by Spontaneous Phase Transition for Electronics’ Safety and Long‐Life Cooling;Advanced Engineering Materials;2023-03-17

5. Improving the heat conduction and mechanical properties of thermal interface materials by constructing diphase continuous structure reinforced by liquid metal;Composites Part A: Applied Science and Manufacturing;2022-11

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