Copper metallization of low-dielectric-constant a-SiCOF films for ULSI interconnects
Author:
Publisher
IOP Publishing
Subject
Condensed Matter Physics,General Materials Science
Reference28 articles.
1. Advertisers in This Issue
2. Stability of the dielectric properties of PECVD deposited carbon-doped SiOF films
3. Formation and characterization of the fluorocarbonated-SiO2 films by O2/FTES-helicon plasma chemical vapor deposition
4. Thermal stability and breakdown strength of carbon-doped SiO2:F films prepared by plasma-enhanced chemical vapor deposition method
5. Deposition of thermally stable, low dielectric constant fluorocarbon/SiO2 composite thin film
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A universal strategy for green synthesis of biomass-based transition metal single-atom catalysts by simple hydrothermal and compression treatment;Chemical Engineering Journal;2023-04
2. Hydrothermally derived water-dispersible mixed valence copper-chitosan nanocomposite as exceptionally potent antimicrobial agent;Journal of Nanoparticle Research;2014-10
3. Microstructuring of Dual Damascene Opening by Hot Embossing Combined with Etch-Back Process;Japanese Journal of Applied Physics;2008-06-20
4. Effects of NH3 plasma pretreatment on initial reactions of atomic layer deposition TaN barrier layer on SiOC dielectric;Applied Physics Letters;2007-12-10
5. Effect of N2 Plasma Annealing on Properties of Fluorine Doped Silicon Dioxide Films with Low Dielectric Constant for Ultra-Large-Scale Integrated Circuits;Chinese Physics Letters;2002-05-28
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3