Contact resistivity due to oxide layers between two REBCO tapes
Author:
Publisher
IOP Publishing
Subject
Materials Chemistry,Electrical and Electronic Engineering,Metals and Alloys,Condensed Matter Physics,Ceramics and Composites
Link
https://iopscience.iop.org/article/10.1088/1361-6668/ab714d/pdf
Reference32 articles.
1. HTS Pancake Coils Without Turn-to-Turn Insulation
2. 26 T 35 mm all-GdBa2Cu3O7–xmulti-width no-insulation superconducting magnet
3. Effect of Resistive Metal Cladding of HTS Tape on the Characteristic of No-Insulation Coil
4. Metal-as-insulation variant of no-insulation HTS winding technique: pancake tests under high background magnetic field and high current at 4.2 K
5. Quench transient current and quench propagation limit in pancake wound REBCO coils as a function of contact resistance, critical current, and coil size
Cited by 16 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A Novel Contact Resistance Model for the Spherical–Planar Joint Interface Based on Three Dimensional Fractal Theory;Fractal and Fractional;2024-08-26
2. Influence of Welding on the Transient Process of HTS Metal-as-Insulation Magnets;IEEE Transactions on Applied Superconductivity;2024-06
3. Investigation of a repeatable and widely applicable method to reduce the turn-to-turn contact resistivity of REBCO tapes;Physica C: Superconductivity and its Applications;2024-02
4. An experimental study to investigate magnetic field and winding force-dependent contact resistance of NI REBCO coil;Superconductor Science and Technology;2024-01-12
5. Aging effect on copper stabilizers in second-generation high-temperature superconducting tapes;Materials Characterization;2023-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3