Porous silicon as a sacrificial material-Reference-Cited by-同舟云学术

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Porous silicon as a sacrificial material

Published:1996-12-01 Issue:4 Volume:6 Page:361-369
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Bell T E,Gennissen P T J,DeMunter D,Kuhl M

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference42 articles.

1. Anisotropic etching of silicon

2. TMAH/IPA anisotropic etching characteristics

3. Compensation structures for convex corner micromachining in silicon

4. Using porous silicon as a sacrificial layer

5. Development of surface micromachining techniques compatible with on-chip electronics

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