Excimer laser-induced formation of metallic microstructures by electroless copper plating
Author:
Publisher
IOP Publishing
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Selective‐area electroless copper plating on polyimide employing laser patterning of a catalytic film
2. 100 nm wide copper lines made by selective electroless deposition
3. New approach of a laser-induced forward transfer for deposition of patterned thin metal films
4. Direct Writing of Copper Film Patterns by Laser‐Induced Decomposition of Copper Acetate
5. Mechanistic insights into metal-mediated electroless copper plating employing hypophosphite as a reducing agent
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1. A siloxane interlayer approach to enhance surface metallization on polyamide fabrics via electroless copper deposition;Surfaces and Interfaces;2023-11
2. Electrokinetic energy conversion in a finite length superhydrophobic microchannel;Chemical Physics Letters;2018-07
3. Laser-Assisted Electroless Metallization of Polymer Materials;Progress in Adhesion and Adhesives;2017-06-30
4. 3D printed conductive patterns based on laser irradiation;physica status solidi (a);2017-04-13
5. Laser-assisted Electroless Metallization of Polymer Materials: A Critical Review;Reviews of Adhesion and Adhesives;2016-09-27
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