Thick film oxidation of copper in an electroplated MEMS process-Reference-Cited by-同舟云学术

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Thick film oxidation of copper in an electroplated MEMS process

Published:2013-05-07 Issue:6 Volume:23 Page:065017
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Lazarus N,Meyer C D,Bedair S S,Song X,Boteler L M,Kierzewski I M

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://stacks.iop.org/0960-1317/23/i=6/a=065017/pdf

Reference38 articles.

1. High-Inductance-Density, Air-Core, Power Inductors, and Transformers Designed for Operation at 100–500 MHz

2. MEMS post-packaging by localized heating and bonding

3. Oxidation behaviour of Cu thin films on Si wafer at 175–400°C

4. Copper Oxide Films

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1. Application of Radiative Cooling in MEMS Thermoelectric Power Generation;Energy and Environment Research in China;2022

2. Tunable surface boundary conditions in strain gradient crystal plasticity model;Mechanics of Materials;2020-06

3. Influence of Carbyne Content on the Mechanical Performance of Nanothick Amorphous Carbon Coatings;Nanomaterials;2020-04-18

4. Modeling, fabrication and testing of MEMS tunable inductors varied with piezoelectric actuators;Journal of Micromechanics and Microengineering;2014-08-11

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