Author:
Choi Woo-Beom,Ju Byeong-Kwon,Lee Yun-Hi,Jeong Jee-Won,Haskard M R,Lee Nam-Yang,Sung Man-Young,Oh Myung-Hwan
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Cited by
14 articles.
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1. Wafer Bonding;Reference Module in Materials Science and Materials Engineering;2016
2. Low-Temperature Silicon-to-Silicon Anodic Bonding Using Sodium-Rich Glass for MEMS Applications;Journal of Electronic Materials;2013-11-07
3. Electrothermally bonded carbon nanotube interfaces;2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems;2008-05
4. Fracture of anodic-bonded silicon-thin film glass-silicon triple stacks;Engineering Fracture Mechanics;2008-03
5. Fabrication of single crystalline MEMS DM using anodic wafer bonding;SPIE Proceedings;2008-02-07