A novel 3D process for single-crystal silicon micro-probe structures-Reference-Cited by-同舟云学术

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A novel 3D process for single-crystal silicon micro-probe structures

Published:2002-06-21 Issue:5 Volume:12 Page:650-654
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Park Sangjun,Kim Bonghwan,Kim Jongpal,Paik Seungjoon,Choi Byoung-Doo,Jung Ilwoo,Chun Kukjin,Cho Dong-il $lquot$Dan$rquot$

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference13 articles.

1. A BiCMOS active substrate probe-card technology for digital testing

2. Thermally actuated microprobes for a new wafer probe card

3. A New Micromachining Technique with (111) Silicon

4. The surface/bulk micromachining (SBM) process: a new method for fabricating released MEMS in single crystal silicon

Cited by 31 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Fabrication of 3-D Silicon Microneedles Using a Single-Step DRIE Process;Journal of Microelectromechanical Systems;2015-10

2. MEMS probes for on-wafer RF microwave characterization of future microelectronics: design, fabrication and characterization;Journal of Micromechanics and Microengineering;2015-06-24

3. Design and fabrication of a mems test socket with an attached tip for a ball-grid-array integrated circuit package;Journal of Mechanical Science and Technology;2014-07

4. An integrated electroless nickel plating process for fabrication of CMOS-MEMS probe chip;Microelectronic Engineering;2014-01

5. Design, fabrication and characterization of MEMS probe card for fine pitch IC testing;Sensors and Actuators A: Physical;2013-12

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