1. Q. Qiao, M. H. Gordon, W. F. Schmidt, L. Li, S. S. Ang and B. Huang, Development of a wafer-level burn-in test socket for fine-pitch BGA interconnect, Proc. IEEE Electronic Components and Technology Conference (2000) 1147.
2. Y. Kinoshita, U.S. Patents Application, 10/553, 189 (2006).
3. M. K. Chen, C.C. Tai, Y. J. Huang and L. K. Fang, Electrical characterization of BGA test socket for high-speed applications, Proc. IEEE Int. Symp. Electronic Materials and Packaging (2002) 123.
4. D. Y. Shih, P. Lauro, K. Fogel, B. Beaman, Y. H. Liao and J. Hedrick, New ball grid array module test sockets, Proc. of IEEE Electronic Components and Technology Conference (1996) 467.
5. B. Chan and P. Singh, BGA sockets-a dendritic solution, Proc. IEEE Electronic Components and Technology Conference (1996) 460.