Fracture strength characterization for 25 micron and 125 micron thick SOI-MEMS structures-Reference-Cited by-同舟云学术

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Fracture strength characterization for 25 micron and 125 micron thick SOI-MEMS structures

Published:2015-06-08 Issue:7 Volume:25 Page:075018
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Buchheit Thomas E,Phinney Leslie M

Funder

U.S. Department of Energy National Nuclear Security Administration

DoD/DOE Joint Munitions Technology Development Program (JMP)

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Link

http://stacks.iop.org/0960-1317/25/i=7/a=075018/pdf

Reference26 articles.

1. Frontiers of silicon-on-insulator

2. High aspect ratio silicon etch: A review

3. Thermal Analysis of MEMS Actuator Performance

4. Moving reflector type micro optical switch for high-power transfer in a MEMS-based safety and arming system

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An SOI-based post-fabrication process for compliant MEMS devices;Journal of Micromechanics and Microengineering;2024-03-12

2. Optimization of the Geometry of a Microelectromechanical System Testing Device for SiO2—Polysilicon Interface Characterization;ECSA 2023;2023-11-15

3. An Soi-Based Fabrication Process for Compliant Mems Devices;2023

4. Biaxial flexure testing of free-standing thin film membrane with nanoindentation system;Sensors and Actuators A: Physical;2018-08

5. Fracture and Fatigue in Microsystems;Mechanics of Microsystems;2018-02-12

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