Patterned cracks improve yield in the release of compliant microdevices from silicon-on-insulator wafers-Reference-Cited by-同舟云学术

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Patterned cracks improve yield in the release of compliant microdevices from silicon-on-insulator wafers

Published:2011-06-30 Issue:8 Volume:21 Page:087001
ISSN:0960-1317
Container-title:Journal of Micromechanics and Microengineering
language:
Short-container-title:J. Micromech. Microeng.

Author:

Hill G C,Padovani J I,Doll J C,Chui B W,Rugar D,Mamin H J,Harjee N,Pruitt B L

Publisher

IOP Publishing

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials

Reference12 articles.

1. What kinds of SOI wafers are suitable for what micromachining purposes?

2. Stress in thermal SiO2during growth

3. Nanoscale magnetic resonance imaging

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Controlled Release of Microcantilever from a Silicon-on-Insulator Wafer with Oxide Brace;2021 International Conference on Radar, Antenna, Microwave, Electronics, and Telecommunications (ICRAMET);2021-11-23

2. Cracking-assisted fabrication of nanoscale patterns for micro/nanotechnological applications;Nanoscale;2016

3. Biomolecule recognition using piezoresistive nanomechanical force probes;Applied Physics Letters;2013-06-24

4. Faster than the Speed of Hearing: Nanomechanical Force Probes Enable the Electromechanical Observation of Cochlear Hair Cells;Nano Letters;2012-11-29

5. High-bandwidth piezoresistive force probes with integrated thermal actuation;Journal of Micromechanics and Microengineering;2012-07-26

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