Experimental investigation of an embedded root method for stripping SU-8 photoresist in the UV-LIGA process
Author:
Publisher
IOP Publishing
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Mechanics of Materials,Electronic, Optical and Magnetic Materials
Reference15 articles.
1. Mechanical characterization of a new high-aspect-ratio near UV-photoresist
2. SU-8: a low-cost negative resist for MEMS
3. UV-LIGA process for high aspect ratio structure using stress barrier and C-shaped etch hole
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1. Effective and efficient removing method of micromolds in UV-LIGA using CO2 laser ablation followed by O2/CF4 plasma finishing for high-aspect-ratio metallic microstructures;The International Journal of Advanced Manufacturing Technology;2020-09-22
2. Microelectroforming of freestanding metallic microcomponents using silver-coated poly(dimethylsiloxane) molds;Journal of Micromechanics and Microengineering;2020-03-12
3. A Novel Hybrid Removal Technology for High-Aspect-Ratio SU-8 Micromolds in ECF (Electro-Conjugate Fluid) Micropumps Fabrication by UV-LIGA;Journal of Microelectromechanical Systems;2018-10
4. Challenges and Issues of Using Polymers as Structural Materials in MEMS: A Review;Journal of Microelectromechanical Systems;2018-08
5. Fabrication of Metal Micro Needle Array by LIGA Process;Advanced Materials Research;2011-12
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